Aehr wins major order for SiC wafer test and burn-in system
FOX-NP system, including the FOX WaferPak Aligner and initial WaferPaks, are scheduled to ship over the next few months
Aehr Test Systems, a Fremont-based supplier of semiconductor test and burn-in equipment, has received an initial customer order for a FOX-NP wafer level test and burn-in system, multiple WaferPak Contactors, and a FOX WaferPak Aligner to be used for engineering, qualification, and small lot production wafer level test and burn-in of SiC devices.
This new customer is a major semiconductor company with locations across Europe, Asia, and the Americas that serves various industries including automotive, industrial, mobile, and consumer applications. The FOX-NP system, including the FOX WaferPak Aligner and initial WaferPaks, are scheduled to ship over the next few months
The FOX-NP system is configured with the new Bipolar Voltage Channel Module (BVCM) and Very High Voltage Channel Module (VHVCM) options that enable new advanced test and burn-in capabilities for SiC power semiconductors using Aehr’s proprietary WaferPak full wafer Contactors.
Gayn Erickson, president and CEO of Aehr Test Systems, commented: “We are very excited that this new customer selected our FOX-P solution for engineering, qualification, and production of their SiC power devices. After working with the Aehr team and our technology solutions over an extended period of time, they felt secure in our ability to aid them in achieving these goals. A key feature in their selection of our FOX solution is its proven ability to cost-effectively implement their target burn-in and stabilisation requirements, including 100 percent traceability and proof that every device on the wafer is burned in for the needed test duration."
Erickson added: “This customer currently has a wide range of automotive products and is entering the SiC market to address several applications that include automotive, industrial, and electrification infrastructure. Key capabilities of our solution include our ability to scale from engineering and qualification and small lot production with the FOX-NP system to large scale production with the FOX-XP with Automated WaferPak Aligner. They have told us that they plan to transition to our FOX-XP multi-wafer test and burn-in systems for high-volume production. Aehr’s FOX-P technology facilitates a seamless transition from engineering to high-volume production with 100 percent compatibility between systems."
The FOX-XP and FOX-NP systems, available with multiple WaferPak Contactors (full wafer test) or multiple DiePakc Carriers (singulated die/module test) configurations, are capable of functional test and burn-in/cycling of devices such as SiC and GaN power semiconductors, silicon photonics as well as other optical devices, 2D and 3D sensors, flash memories, magnetic sensors, microcontrollers, and other leading-edge ICs in either wafer form factor, before they are assembled into single or multi-die stacked packages, or in singulated die or module form factor.
