In-depth News Analysis

Processing promise
As UK government dedicates £50 million to compound semiconductor device development, what can industry expect next, asks Compound Semiconductor.
Imec breaks down 3D memory barriers
Integrating a high mobility InGaAs channel to 3D NAND Flash memory is set to solve the read speed issues plaguing Samsung, Toshiba and more.
Deep UV: the road to mass production
SETi's recent Nitek acquisition looks set to deliver cheaper UV LEDs, faster than ever before. Compound Semiconductor reports.
Designs for light
Could a new design flow from Cadence accelerate the manufacture of photonics ICs? Compound Semiconductor finds out more.
Move over magnetron
Do the latest LDMOS and GaN RF power devices mark the end of the magnetron-based microwave, asks Compound Semiconductor?

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