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LATEST INDUSTRY NEWS - view all

 
 

 

 

PowerFLEX thin-film module is awarded IEC and UL certifications - June 01, 2011
The Most Efficient Flexible Solar Module...

Sofradir’s MCT detectors to power Sentinel-5-Precursor space mission - June 01, 2011
Over the last 12 years, Sofradir has optimised the design of the focal plane array...

CIGS to emerge as the major technology by 2020 - June 01, 2011
Despite caution in the overall PV industry, the thin film market is expected to experience...

EPC reveals second generation 200 V eGaN power transistor - June 01, 2011
The EPC2010 delivers high frequency switching with enhanced performance in a lead-free, RoHS compliant package....

GaAs RF device revenue to top $300 million - May 31, 2011
Strategy Analytics’ latest report says that as operators deploy more base stations to handle the...

Genesis Photonics Places Multi-Unit Order for MaxBright MOCVD Systems - May 31, 2011
Veeco Instruments Inc. today announced that Taiwan based Genesis Photonics Inc. (GPI) has placed a...

Compound Semiconductor Greater China - May 27, 2011
Compound Semiconductor announce the re-launch of Compound Semiconductor Greater China magazine...

Ruukki first to offer fully-integrated CIGS solar panel facade - May 27, 2011
The firm says that its solar power system is unique because it is fully integrated...

NI to acquire RF tool designer AWR for $58 million - May 27, 2011
AWR’s Microwave Office and Visual System Simulator products will strengthen NI capabilities in RF design...

Changelight receives 2,000th Aixtron MOCVD system - May 27, 2011
The reactors will be used to manufacture high-quality AlGaInP Red Orange Yellow (ROY) HB LED...

Kyma enhances product portfolio with AlGaN templates - May 27, 2011
Initially developed as part of an advanced mid UV LED technology research project, the firm...

 

LATEST COMPANY NEWS - view all

 
 

 

 

Philips Lumileds and Future Electronics Extend Worldwide Exclusive Agreement - June 02, 2011
Philips Lumileds and Future Electronics have announced the extension of their exclusive worldwide distribution relationship....

OPEL Solar to propose name change to OPEL Technologies - June 01, 2011
The name change should provide more focus and a clear framework for the two distinct...

Avago provides WiMAX coexistence FEM to simplify mobile electronics - June 01, 2011
The highly-integrated, small-footprint module is claimed to be the first to deliver coexistence operation of...

Avago anchors integrated switch and GaAs LNAs for base stations - June 01, 2011
The TD-SCDMA and TD-LTE compact fully-matched products replace three discrete devices to save PCB space,...

Anadigics shipping volumes of multi-band PAs to Qualcomm - June 01, 2011
The new PA supports five frequency bands, enabling the multi-band Qualcomm Gobi 3000 module....

 

LATEST LAB & FAB TALK NEWS - view all

 
 

 

 

Thickness of graphene on SiC no longer an enigma - May 24, 2011
New developments have shown that the thickness of graphene on SiC can be measured using...

Researchers conjure up nanocavity super efficient laser - May 17, 2011
The GaAs/InAs laser is suited to optical communication systems and could herald a new era...

III-V cells could help plants to provide more efficient solar energy - May 13, 2011
The multi-junction tandem solar cell initially developed at NREL has proved to be an important...

VCSEL slashes power consumption in atomic clock - May 05, 2011
The GaAs based VCSEL operating at a wavelength of 894 nm operates at only 2...

ORNL solar cell technology cranks up efficiency - May 04, 2011
The structure consists of n-type zinc oxide nanocones surrounded by a p-type polycrystalline CdTe semiconductor....

 


 

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latest features

 
 

 

 

Integrating the compounds with silicon

June 01, 2011
Are you are looking for a resource covering all aspects of III-Vs on silicon development, ...

Research Review: Nanolithography promises cheaper telecom lasers

June 01, 2011
Engineers produce 20 mW lasers with a side-mode suppression ratio of 60 dB using nano-imprint ...

 
 
 
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Compound Semiconductor - Volume 17 Number 3 - April/May 2011

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