Palomar Tech has a wire-bond-free direct attach for LEDs

Feb 03, 2012 The provider of microelectronics and optoelectronic packaging systems has developed a precision eutectic process for these devices
Donald Beck, General Manager of Palomar Technologies Assembly Services, says, “Direct-attach LEDs are the next generation of solid-state LED emitters that deliver superior value for consumer products and markets that include TV backlighting, camera flash and a variety of general illumination needs.”

“Assembly Services is supporting more than 390 700µm LEDs that are attached with an Au/Sn solder to a single 50mm metal core carrier. Palomar Technologies’ Pulsed Heat System is a major contributor to this development, allowing our precision die attach systems to control LED exposure much more effectively than most other processes. The bondpad-down design of direct-attach LEDs eliminates the need for wire bonds, yet improves the thermal management”, he continues.

Palomar Technologies is exhibiting at the LED-focused show, Strategies in Light 2012, in booth #709 on February 7-9 in Santa Clara, CA. Julie Adams, Director of WW Assembly Services Sales will be on site to assist in discussions about Palomar Technologies’ current LED packaging capabilities, including direct-attach LED eutectic bonding.

Also on February 7-9, Palomar Technologies is exhibiting as a premier sponsor at IMAPS RF 2012 in booth #RF01, held in San Diego, CA. Bradley Benton, Western Americas Sales Manager, will be presenting an overview of Palomar Technologies’ solutions and advanced RF automated packaging processes on February 8 at 1:00pm, local conference time.

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